Creo Parametric 9.0 for Engineers and Designers

Prof. Sham Tickoo

SKU: 9789355519795

Rs. 1,799
ISBN: 9789355519795
Authors: Prof. Sham Tickoo
Rights: SAARC countries
Edition: 2024
Pages: 1016
Dimension: 7.5*9.25 Inches
Book Type: Paperback

Creo Parametric 9.0 for Engineers and Designers textbook introduces the readers to Creo 9.0, the world's leading parametric solid modeling package. In this textbook, the author emphasizes the solid modeling techniques that improve the productivity and efficiency of the users. Also, the chapters are structured in a pedagogical sequence that makes this textbook very effective in learning the features and capabilities of the software.

  1. Introduction to Creo Parametric 9.0
  2. Creating Sketches in the Sketch Mode-I
  3. Creating Sketches in the Sketch Mode-II
  4. Creating Base Features
  5. Datums
  6. Options Aiding Construction of Parts-I
  7. Options Aiding Construction of Parts-II
  8. Options Aiding Construction of Parts-III
  9. Advanced Modeling Tools
  10. Assembly Modeling
  11. Generating, Editing, and Modifying the Drawing Views
  12. Dimensioning the Drawing Views
  13. Other Drawing Options
  14. Working with Sheetmetal Components
  15. Surface Modeling
  16. Introduction to Mold Design
  17. Concepts of Geometric Dimensioning and Tolerancing

Prof. Sham Tickoo is currently working as a Professor at Purdue University, USA. He received MS in Industrial Technology from Northern Illinois University, Illinois, USA; MS in Industrial and Management Engineering from the University of Iowa, Iowa City, USA; and BS in Mechanical Engineering from NIT, Srinagar, India. Before joining Purdue University in 1987, Prof. Tickoo has worked as a Design Engineer, Quality Control Engineer, and Software Developer. Prof. Tickoo has authored/co-authored textbooks on several major CAD/CAE/Animation software packages like SolidWorks, CATIA, Pro/Engineer, NX, AutoCAD, Customizing AutoCAD, AutoCAD LT, Solid Edge, 3ds Max, 3ds Max Design, Autodesk Inventor, Mechanical Desktop, and VIZ. In addition to North America, his textbooks have been translated and published in Russia, Japan, India, South Korea, and Serbia. Prof. Tickoo has obtained over $24 Million software grant from ANSYS, IBM, and Siemens. 

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