Solid Works 2018

Prof. Sham Tickoo

SKU: 9789388176316

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ISBN: 9789388176316
Authors: Prof. Sham Tickoo
Rights: Worldwide
Publishing Date: January 2018
Pages: 418
Weight:
Dimension: 23.5 X 19 X 4.5 cm
Book Type: Paperback

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"This textbook introduces the readers to learn solid modeling, Assembling and drafting techniques required to create the industrial component. This textbook covers various methods and techniques used for creating and analyzing models in the real-world environment have been explained through tutorials supported by the textual description.

Chapter 1: Introduction to SOLIDWORKS 2018

Chapter 2: Drawing Sketches for Solid Models

Chapter 3: Editing and Modifying Sketches

Chapter 4: Adding Relations and Dimensions to Sketches

Chapter 5: Advanced Dimensioning Techniques and Base Feature Options  

Chapter 6: Creating References Geometries

Chapter 7: Advanced Modeling Tools-I

Chapter 8: Advanced Modeling Tools-II

Chapter 9: Assembly Modeling

Chapter 10: Working with Drawing Views

Chapter 11: Introduction to FEA and SOLIDWORKS Simulation

Chapter 12: Introduction to Mold Design

Student Project

Index

Prof. Sham Tickoo is currently working as a Professor at Purdue University, USA. He received MS in Industrial Technology from Northern Illinois University, Illinois, USA; MS in Industrial and Management Engineering from the University of Iowa, Iowa City, USA; and BS in Mechanical Engineering from NIT, Srinagar, India. Before joining Purdue University in 1987, Prof. Tickoo has worked as a Design Engineer, Quality Control Engineer, and Software Developer. Prof. Tickoo has authored/co-authored textbooks on several major CAD/CAE/Animation software packages like SolidWorks, CATIA, Pro/Engineer, NX, AutoCAD, Customizing AutoCAD, AutoCAD LT, Solid Edge, 3ds Max, 3ds Max Design, Autodesk Inventor, Mechanical Desktop, and VIZ. In addition to North America, his textbooks have been translated and published in Russia, Japan, India, South Korea, and Serbia. Prof. Tickoo has obtained over $24 Million software grant from ANSYS, IBM, and Siemens. 

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