SOLIDWORKS 2018 for Designers

This textbook introduces the readers to SOLIDWORKS 2018, the world’s leading parametric solid modelling packages. In this textbook, the author emphasizes on Solid modelling techniques that improve the productivity and efficiency of the users. Also, the chapters are structured in a pedagogical sequence that makes this textbook very effective in learning the features and capabilities of the software.

1. Introduction to SOLIDWORKS 2018
2. Drawing Sketches for Solid Models
3. Editing and Modifying Sketches
4. Adding Relations and Dimensions to Sketches
5. Advanced Dimensioning Techniques and Base Feature Options
6. Creating Reference Geometries
7. Advanced Modelling Tools-I
8. Advanced Modelling Tools-II
9. Editing Features
10. Advanced Modelling Tools-III
11. Advanced Modelling Tools-IV
12. Assembly Modelling- I
13. Assembly Modelling- II
14. Working with Drawing Views- I
15 Working with Drawing Views- II
16. Surface Modelling
17. Working with Blocks
18. Sheet Metal Design
19. Equations, Configurations and Library Features
20. Motion Study
21. Introduction to Mold Design

Student Project

Index

Prof. Sham Tickoo is currently working as a Professor at Purdue University, USA. He received MS in Industrial Technology from Northern Illinois University, Illinois, USA; MS in Industrial and Management Engineering from the University of Iowa, Iowa City, USA; and BS in Mechanical Engineering from NIT, Srinagar, India. Before joining Purdue University in 1987, Prof. Tickoo has worked as a Design Engineer, Quality Control Engineer, and Software Developer. Prof. Tickoo has authored/co-authored textbooks on several major CAD/CAE/Animation software packages like SolidWorks, CATIA, Pro/Engineer, NX, AutoCAD, Customizing AutoCAD, AutoCAD LT, Solid Edge, 3ds Max, 3ds Max Design, Autodesk Inventor, Mechanical Desktop, and VIZ. In addition to North America, his textbooks have been translated and published in Russia, Japan, India, South Korea, and Serbia. Prof. Tickoo has obtained over $24 Million software grant from ANSYS, IBM, and Siemens.